Electroplating of superconductor elements

Details Electroplating of superconductor elements Electroplating of superconductor elements

1992-06-02

1993-09-14

Niebling, John

Superconductor technology: apparatus, material, process

High temperature , per se

Having tc greater than or equal to 150 k

205 51, 205138, 205170, 205224, H01L 3900, C25D 504

Patent

active

052448754

ABSTRACT:
Processes and techniques are described for concurrent electroplating of yttrium, barium and copper from aqueous solution onto a desired substrate (e.g., nickel, nichrome or silver). Compounds of these elements are dissolved in solution and then placed in a plating cell in which the cathode is the substrate on which the elements are to be deposited. After the elements have been deposited, they are oxidized to provide the desired perovskite structure. The process may be continuous or non-continuous.

REFERENCES:
patent: 4870051 (1989-09-01), Maxfield et al.
patent: 4914081 (1990-04-01), Miller et al.
patent: 4994435 (1991-02-01), Shiga et al.
patent: 5032236 (1991-07-01), Saitou et al.
patent: 5120707 (1992-06-01), Maxfield et al.

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