Electroplating of nickel on nickel ferrite devices

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal coating

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205273, 205274, 205280, 205257, 205176, 205182, 205184, 205186, 205187, C25D 312, C25D 510, C25C 2802

Patent

active

057798737

ABSTRACT:
This invention is predicated on the discovery by the present applicants that boric acid in conventional nickel plating baths is responsible for excessive lateral growth in the electroplating of nickel on nickel ferrite substrates. While nickel baths without boric acid do not yield acceptable electrodeposits, the boric acid interacts with the ferrite substrate to cause excessive lateral growth. Applicants further discovered that by eliminating the boric acid and adding another acidic plating buffer such as citric acid, one can obtain isotropic nickel plating and produce a wire-bondable surface.

REFERENCES:
patent: 4270986 (1981-06-01), Smith
patent: 4375390 (1983-03-01), Anderson
"Borate Buffer Equilibria in Nickel Refining Electrolytes", by Tilak, B. V. et al., Journal of Applied Electrochemistry, 7, pp. 495-500 (1977). No month available.
"Nickel Solution Buffers and Limiting Current Density," by DuRose, A. H., Plating and Surface Finishing, pp. 48-52 (Aug. 1977).
"The Buffering Action of Nickel Acetate in Nickel Plating Solutions", by Gluck, G., Plating and Surface Finishing, pp. 865-869 (Sep. 1975).
"Boric Acid in Nickel Solutions", by DuRose, A. H., Plating and Surface Finishing, pp. 52-55 (Aug. 1977).
"Nickel and Chromium Plating", by Dennis, J. K. et al., Butterworth & Co. (Publishers) Ltd. (1986). No month available.
"Decorative/Protection Coatings, Copper, Nickel, Chromium", by Lowenheim, F. A., Electroplating, pp. 210-219. No date.
"Nickel Sulfamate Plating, Its Mystique and Practicality", by Baudrand, D., Metal Finishing, pp. 15-18 (Jul. 1996).
Lowenheim, "Decorative/protection Coatings, Copper, Nickel, Chromium", Electroplating, pp. 210-219. No date.

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