Electroplating of fine particles with metal

Details Electroplating of fine particles with metal Electroplating of fine particles with metal

1989-04-20

1990-03-13

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

G25D 500

Patent

active

049081063

ABSTRACT:
Disclosed herein suspension electroplating of fine particles with metal. An electroplating operatively equipped with a cathode and anode is charged with a metallic ion-containing electrolyte and particles to be electroplated. The particles have a size of from 0.1 to 10 .mu.m. At least a part of the surface of each particle is conductive. Such a stationary circulating flow of a suspension of the particles in the electrolyte is formed in the bath that the particles are maintained in the suspended condition; the suspension is circulated substantially without coming in contact with the anode; the particles may have a chance of colliding with substantially all surface areas of the working surface of the cathode, and are repeatedly brought in collision with the cathode at a velocity with a normal component of from 0.6 to 6.0 m/min.; and a particle concentration of the suspension at the time of collision is from 30 to 55% by volume. When such a stationary flow has been formed, a current for electroplating is caused to pass, whereupon deposition of metal on the particles proceeds without deposition of the particles and metal on the cathode.

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