Electroplating method for a semiconductor device

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly alloy coating

Reexamination Certificate

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C205S123000, C205S140000, C205S145000

Reexamination Certificate

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11002437

ABSTRACT:
An electroplating method calls for immersing a body to be plated in a plating solution containing tin and bismuth to form a tin-bismuth alloy skin layer on surfaces of the body. The plating is carried out such that a solid tin metal and a solid bismuth metal placed in the plating solution are connected to an anode and the body to be plated is connected to a cathode of a power supply.

REFERENCES:
patent: 4439284 (1984-03-01), Walter
patent: 5039576 (1991-08-01), Wilson
patent: 5674374 (1997-10-01), Sakurai et al.
patent: 5744013 (1998-04-01), Botts et al.
patent: 6342146 (2002-01-01), Velasquez
patent: 02088790 (1990-03-01), None
patent: 7-065206 (1995-03-01), None
patent: 2000045099 (2000-02-01), None

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