Electroplating method for a semiconductor device

Details Electroplating method for a semiconductor device Electroplating method for a semiconductor device

2008-01-29

2008-01-29

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

C205S123000, C205S140000, C205S145000

Reexamination Certificate

active

07323097

ABSTRACT:
An electroplating method calls for immersing a body to be plated in a plating solution containing tin and bismuth to form a tin-bismuth alloy skin layer on surfaces of the body. The plating is carried out such that a solid tin metal and a solid bismuth metal placed in the plating solution are connected to an anode and the body to be plated is connected to a cathode of a power supply.

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patent: 02088790 (1990-03-01), None
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