Electroplating method and apparatus

Details Electroplating method and apparatus Electroplating method and apparatus

1975-03-13

1976-01-20

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204273, 204277, C25D 704, C10G 1706

Patent

active

039336018

ABSTRACT:
An electroplating method is disclosed and includes the rotation of a substrate, submerged within an electrolytic solution, under the application of ultrasonic waves, and the ejection of the electrolytic solution containing bubbles in a direction opposite the direction of rotation of the substrate. The electroplating apparatus for electroplating the substrate submerged within the electrolytic solution disposed within an electrolytic cell applies ultrasonic waves to the solution and additionally includes a driving device for rotating the substrate, a bubble generator for entraining bubbles within the electrolytic solution, and an ejector for ejecting the electrolytic solution containing the bubbles generated by means of the bubble generator in a direction which is opposite to the direction of rotation of the substrate.

REFERENCES:
patent: 1884512 (1932-10-01), Ballard
patent: 2155392 (1939-04-01), Ballard
patent: 2435872 (1948-02-01), Coulson
patent: 2702260 (1955-02-01), Massa
patent: 2744860 (1956-05-01), Rines
patent: 2888939 (1959-06-01), Nitsche
patent: 3647646 (1972-03-01), Tucker et al.

Affiliated with

Also associated with

Rating

Electroplating method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroplating method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1695193