Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Contacting coating as it forms with solid member or material...
Patent
1998-07-24
2000-11-07
Gorgos, Kathryn
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Contacting coating as it forms with solid member or material...
204200, 204203, 204209, 204215, 204217, 204224R, 205117, 205137, C25D 506
Patent
active
061431567
ABSTRACT:
The present invention provides an improved method for electroplating metallic ions onto a conductive substrate. In one embodiment, the method comprises at least partially covering a selected surface of the conductive substrate with an electrode wrap that includes a pad having an abrasive surface.
The metallic ions are electrically depositing onto the selected surface through the electrode wrap while the conductive substrate is moved (e.g., rotated) relative to the electrode wrap. A substantially constant frictional force is controllably applied from the abrasive surface onto the selected surface while the metallic ions are being deposited. In this manner, a substantially constant abrasive force is applied to the selected surface as the thickness of the deposited metallic coating increases to create a relatively smooth, uniform, thick deposition that is substantially free of defects.
REFERENCES:
patent: 3619383 (1971-11-01), Eisner
patent: 4129492 (1978-12-01), Morton et al.
patent: 4270986 (1981-06-01), Smith
patent: 4610772 (1986-09-01), Palnik
patent: 4655881 (1987-04-01), Tezuka et al.
patent: 4772361 (1988-09-01), Dorsett et al.
patent: 5116480 (1992-05-01), Palnik
patent: 5277785 (1994-01-01), Van Anglen
patent: 5324406 (1994-06-01), Anderson et al.
patent: 5389228 (1995-02-01), Long et al.
patent: 5453174 (1995-09-01), Van Anglen et al.
patent: 5571389 (1996-11-01), Kerampran
Nickel and Chromium Plating, Third Edition, J.K. Dennis and T. E. Such, Woodhead Publishing Limited, Cambridge, England, 1993, month of publication not available.
SIFCO Process.RTM. Instruction Manual. .COPYRGT. 1994 SIFCO Industries, Inc., pp. 47, 51, 52, and 53, month of publication not available.
CAE Vanguard, Inc.
Gorgos Kathryn
Leader William T.
LandOfFree
Electroplating method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electroplating method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating method and apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1637279