Chemistry: electrical and wave energy – Processes and products – Electrostatic field or electrical discharge
Patent
1994-05-31
1996-01-23
Niebling, John
Chemistry: electrical and wave energy
Processes and products
Electrostatic field or electrical discharge
204272, 204275, C25C 100
Patent
active
054862728
ABSTRACT:
A method of removing metal from a feedstock solution containing dissolved metal ions which comprises passing the feedstock through an annular gap, the inner surface of which is cathodic to the metal ion and the outer surface of which is anodic in such a way that the flow is turbulent.
Also claimed is an apparatus for removing metal from a feedstock which comprises a reactor afforded by an inner cathode tube, and an outer anode tube spaced therefrom by a narrow annular gap, direct electric current supply means to the anode and cathode, pump means for pumping feedstock into the said annular gap at high flow rates, a holding tank, pipe work connecting the holding tank to the said pump means and the pipe work connecting the end of the annular gap remote from the pump to the holding tank.
REFERENCES:
patent: 3620813 (1971-11-01), Minbiole et al.
patent: 3664354 (1972-05-01), Minbiole et al.
patent: 3704685 (1972-12-01), Neumann et al.
patent: 3782791 (1974-01-01), Neumann et al.
patent: 3941677 (1976-03-01), Bourne
patent: 3951774 (1976-04-01), Jones
patent: 3957599 (1976-05-01), Lindsay et al.
patent: 4149954 (1979-04-01), Ransbottom
patent: 4357225 (1982-11-01), Arita et al.
patent: 4654137 (1987-03-01), Vaughan
Derwent Abstract of SU 1082866to AS Belo Nuclear POW (Mar. 1984).
Gale Albert W.
Hemsley John D. C.
Schwalb Adrian
Enthone-OMI Inc.
Mee Brendan
Mueller Richard P.
Niebling John
LandOfFree
Electroplating method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electroplating method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating method and apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1502900