Electroplating method

Details Electroplating method Electroplating method

1980-01-14

1981-02-17

Tung, T.

Chemistry: electrical and wave energy

Processes and products

204 38B, 204DIG3, 136256, C25D 502, H01L 3118

Patent

active

042513278

ABSTRACT:
A method for electroplating a metallic layer onto the surface of a photovoltaic device absent any external electrical contacts to the surface. The photovoltaic device is placed in an electrolytic plating bath where it is illuminated with electromagnetic radiation to which the device is photovoltaically responsive. Plating from the electrolytic bath results from current flow generated in the device itself.

REFERENCES:
patent: 4144139 (1979-03-01), Durkee
M. G. Coleman et al, "The Pd.sub.2 Si-(Pd)-Ni Solder Plated Metallization System For Silicon Solar Cells", Conf. Record, 13th IEEE Photovoltaic Specialists Conf., Jun. 1978, pp. 597-602.

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