Chemistry: electrical and wave energy – Processes and products
Patent
1975-12-17
1976-12-07
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
204 45R, 204DIG2, C25D 1502, C25D 302
Patent
active
039961141
ABSTRACT:
A layer of metal having a plurality of discrete particles of a finely divided solid non-metallic material uniformly dispersed throughout the metal layer is electrodeposited onto the surface of a substrate metal by first applying an amphoteric surfactant having a substituted imidozolinium structure to the surface of the particles of finely divided non-metallic solid material, or by first introducing the said amphoteric surfactant into the electrolyte solution. The said particles and the said metal are then co-deposited onto the substrate metal from an aqueous acidic electrolyte solution containing metalliferous cations of the said metal in solution and the said particles in suspension therein. Specifically, the amphoteric surfactant employed is selected from the group of substituted imidozolinium derivatives having the chemical structure: ##STR1## Where R is a fatty acid radical having from 6 to 18 carbon atoms. R.sup.1 is H, Na or CH.sub.2 COOM
REFERENCES:
patent: R12567 (1906-11-01), Case
patent: 779639 (1905-01-01), Case
patent: 3061525 (1962-10-01), Grazen
patent: 3617363 (1971-11-01), Metzger
patent: 3844910 (1974-10-01), Lipp
patent: 3890209 (1975-06-01), Shigeta
patent: 3891534 (1975-06-01), Cordone et al.
patent: 3891542 (1975-06-01), Cordone et al.
Browning, M. E. and Dunkerley, F. J. Electro-Combination Forming of Dispersion-Hardened Alloys. Am. Soc. of Mech. Eng. Paper 65-MO-53.
Williams, R. V. and Martin, P. W. Electro Deposited Composite Coatings, Proceedings 6th Int. Metal Finishing Conference 1964 paper P/17/63.
Sykes, J. M. and Alner, D. J. The Use of Surface Active Agents in Promoting Codeposition of Polymer Particles with Electrodeposited Metal, Trans Inst. of Metal Finishing vols. (1973), pp. 171-172.
Raymond John L.
Reath Robert Z.
Tufariello T. M.
LandOfFree
Electroplating method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electroplating method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-377881