Electroplating installation, electrode and support device for th

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

2042861, 204206, 204280, C25C 700

Patent

active

061298204

ABSTRACT:
An electroplating installation for coating the conducting surface of a part. The installation includes electrodes submerged in a bath. The electrodes rest on a support device that serves as a support and a current supply. The electrodes and the support device form an interface defining a plurality of grooves opening into the bath. The grooves may be formed in the electrodes, in the support device, or in both the electrodes and the support device.

REFERENCES:
patent: 3855108 (1974-12-01), Boltz
patent: 5188720 (1993-02-01), Colin et al.
patent: 5228965 (1993-07-01), Ameen et al.
patent: 5944965 (1999-08-01), Ameen et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electroplating installation, electrode and support device for th does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroplating installation, electrode and support device for th, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating installation, electrode and support device for th will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2253743

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.