Electroplating gold alloys and electrolytes therefor

Details Electroplating gold alloys and electrolytes therefor Electroplating gold alloys and electrolytes therefor

1973-07-19

1978-01-17

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 362

Patent

active

040691136

ABSTRACT:
Disclosed is an electrolyte for the deposition of predominantly gold alloy deposits, a method for the preparation and use of the electrolyte, and an article obtained by such electrodeposition. These electrolytes contain soluble gold and base metal salts, a buffer system effective at pH 4-6, and either a soluble aluminum compound or formate or oxalate ions. Preferably, the electrolyte contains both the aluminum and formate or oxalate ions.

REFERENCES:
patent: 2967135 (1961-01-01), Ostrow et al.
patent: 3367853 (1968-02-01), Schumpelt
patent: 3475290 (1969-10-01), Yamamura et al.
patent: 3562120 (1971-02-01), Duva et al.

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