Electroplating film-forming metals in non-aqueous electrolyte

Details Electroplating film-forming metals in non-aqueous electrolyte Electroplating film-forming metals in non-aqueous electrolyte

1983-02-16

1984-08-14

Tufariello, Thomas

Chemistry: electrical and wave energy

Processes and products

204 33, 2041415, C25D 344, C25D 530, C25D 544, C25F 304

Patent

active

044655614

ABSTRACT:
Metals such as lead, silver, copper, calcium, antimony, cadmium, nickel and zinc are electroplated onto a film-forming metal substrate from the group of aluminium, titanium, zirconium, niobium, molybdenum, tungsten, tantalum and alloys thereof, using an etching/electroplating solution comprising ions of the metal(s) to be plated, optionally alkali metal ions, aluminium halide and an aromatic hydrocarbon. Surface oxide is removed from the film-forming metal substrate by reaction with the aluminium halide and the metal(s) in solution to form soluble complexes, this possibly being assisted by anodization. This is followed by cathodically connecting the substrate and passing current to electroplate the metal(s) onto the oxide-free surface, directly in the same etching/electroplating solution.

REFERENCES:
patent: 2791553 (1957-05-01), Conner
patent: 2873233 (1959-02-01), Schnable
patent: 2966448 (1960-12-01), Conner
patent: 4126523 (1978-11-01), Wong
patent: 4388159 (1983-06-01), Dockus

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