Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Reexamination Certificate
1999-02-23
2001-04-17
Gorgos, Kathryn (Department: 1741)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C204S22400M, C204S289000, C204S290010, C204S297080
Reexamination Certificate
active
06217734
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a method and apparatus for electrodepositing on a substrate. In particular, the present invention relates to a method and apparatus for electrodeposition, electroetching, and/or electropolishing in semiconductor device manufacturing.
2. Description of the Related Art
In the production of microelectronic devices, metal may be plated on a semiconductor for a variety of purposes. The metal may be deposited to form vias or conductive lines, such as wiring structures. Typically, metal is plated on the substrates and cells of reservoirs that hold a plating solution that includes at least one metal and/or alloy to be plated on the substrate.
Plating baths are commonly used in microelectronic device manufacture to plate at least one material, such as a metal on a substrate for a wide variety of applications. For example, plating baths may be utilized for electroplating and/or electroless plating on substrates of one or more metals and/or alloys.
SUMMARY OF THE INVENTION
The present invention provides an apparatus for depositing material, electroetching, and/or electropolishing on a surface of a substrate. The apparatus includes at least one contact for laterally contacting the substrate and providing an electrical connection to the substrate. The at least one contact does not obscure the surface of the substrate to be plated. A voltage source is connected to the at least one contact.
The present invention also includes a method for depositing material on a surface of a substrate. The method includes laterally engaging a substrate on which a material is to be deposited with at least one contact for laterally contacting the substrate and providing electrical connection to the substrate without obscuring the surface of the substrate to be plated. A voltage source is connected to the at least one contact.
Still other objects and advantages of the present invention will become readily apparent to those skilled in the art from the following detailed description, wherein it is shown and described only the preferred embodiments of the invention, simply by way of illustration of the best mode contemplated of carrying out the invention. As will be realized, the invention is capable of other and different embodiments, and its several details are capable of modifications in various obvious respects, without departing from the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.
REFERENCES:
patent: 4464242 (1984-08-01), Boulton
patent: 5429733 (1995-07-01), Ishida
patent: 5620581 (1997-04-01), Ang
patent: 5660699 (1997-08-01), Saito et al.
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 6037790 (2000-03-01), Dinan
Abate Esq. Joseph P.
Gorgos Kathryn
International Business Machines - Corporation
Parsons Thomas H.
Pollock, Vande Sande & Amernick, R.L.L.P.
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