Electroplating device, and process for electroplating work...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating moving substrate

Reexamination Certificate

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C205S131000, C205S137000, C205S143000, C029S607000

Reexamination Certificate

active

06923898

ABSTRACT:
An electroplating device including an anode inserted through and disposed in a hole provided in a work and communicating with the outside, and a member for rotating the work about its center axis and supplying a plating electric current to the work. Alternatively, a separate member may supply the plating electric current to the work. A plating solution in the hole in the work may be allowed to flow. Thus, a uniform plated film can be formed on both of the outer and inner surfaces of the work having the communicating with the outside such as a ring-shaped work, of which a ring-shaped bonded magnet is representative, by using the electroplating device.

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Patent Abstracts of Japan; Publication No. 09-041190, Feb. 10. 1997, (abstract only).
Patent Abstracts of Japan; Publication No. 02-197697; Apr. 10, 1990 (abstract only).

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