Electroplating device and method

Details Electroplating device and method Electroplating device and method

1975-06-13

1976-11-30

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204206, 204275, C25D 706, C25D 1700

Patent

active

039947866

ABSTRACT:
There is described an electroplating method and device for accomplishing the same whereby metal plating is disposed on a wire as said wire moves along an established path through the device. Relatively high speed deposition is achieved as a result of intermittent positioning of the device's inlet and outlet ports within the electrically conductive means of the device. The wire to be plated is established at a negative electrical potential and moved through said electrically conductive means. Accordingly, the conductive means is adapted for providing the electrolyte therein with a positive electrical potential to thereby provide the desired deposition.

REFERENCES:
patent: 1065090 (1913-06-01), Werth
patent: 3549507 (1970-12-01), Semienko et al.
patent: 3592753 (1971-07-01), Semienko et al.
patent: 3644181 (1972-02-01), Donaldson
patent: 3865701 (1975-02-01), Borgmann
patent: 3894924 (1975-07-01), Toledo
Def. Pub. T868,001, A. J. Avila et al., Nov. 18, 1969. (pp. 4-11 of the spec. included).

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