Electroplating contacts of printed circuits

Details Electroplating contacts of printed circuits Electroplating contacts of printed circuits

1975-11-21

1976-12-28

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 502

Patent

active

040000451

ABSTRACT:
A printed-circuit board requiring precious metal electroplating of its contact finger areas is adapted for such plating by a temporarily affixed electroplating current carrier of metallic foil held in contact with other printed wiring interconnected with the contact finger areas. The metallic foil is shielded from contact with electroplating baths by a strip of dielectric plastic film, the film and the foil being temporarily held in a selected position on the board by a layer of non-setting pressure-sensitive adhesive.

REFERENCES:
patent: 2834723 (1958-05-01), Robinson
patent: 3014851 (1961-12-01), Bommerscheim
patent: 3597333 (1971-08-01), Kulesza
IBM Tech. Disclosure Bulletin, vol. 2, No. 3, Oct. 1959, p. 32.

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