Electroplating composition and process for plating through holes

Chemistry: electrical and wave energy – Processes and products

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204 1T, 204 521, 204434, C25D 338, C25D 700, G01N 2746

Patent

active

048971650

ABSTRACT:
A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.
Also disclosed is a device for measuring throwing power of a plating solution. The device comprises two anodes and a cathode suspended in a chamber adapted to contain a plating solution. The cathode is suspended between said anodes and comprises two flat electrode portions in electrical contact with each other, in parallel relationship to each other and spaced apart from each other to define a space containing plating solution. Each of said flat electrode portions has electrode portions electrically isolated from a center electrode and means for measuring the current on said first electrode portions and center electrode.

REFERENCES:
patent: 3328273 (1967-06-01), Creutz et al.
patent: 3562117 (1971-02-01), Vander Mey
patent: 3769179 (1973-10-01), DuRose et al.
patent: 3770598 (1973-11-01), Creutz
patent: 4347108 (1982-08-01), Willis
patent: 4673469 (1987-06-01), Beach et al.
Mayer and Barbien, "Characteristics of Acid Copper Sulfate Deposits for Printed Wiring Board Applications", Plating and Surface Finishing, pp. 46-49, Mar. 1981.
Malak, "Acid Copper Plating of Printed Circuits," Products Finishing, pp. 38-44, Mar. 1981.
Amadi, "Plating High Aspect Ratio Multilayer Boards," PC FAB, pp. 85-94, Oct. 1987.

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