Electroplating chemistries and methods of forming...

Details Electroplating chemistries and methods of forming... Electroplating chemistries and methods of forming...

2008-03-04

2008-03-04

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C205S123000, C205S157000, C205S296000

Reexamination Certificate

active

07338585

ABSTRACT:
A method comprising forming an interconnection opening through a dielectric material to a contact point; and electroplating a interconnection comprising copper in the contact opening using an electroplating bath comprising an alkoxylated sulfopropylated alkylamine. A method comprising forming an interconnection opening through a dielectric material to a contact point; lining the interconnection opening with a barrier layer and a seed layer; and electroplating an interconnection comprising copper in the contact opening using an electroplating bath comprising an alkoxylated sulfopropylated alkylamine.

REFERENCES:
patent: 3328273 (1967-06-01), Crentz et al.
patent: 6491803 (2002-12-01), Shen et al.
patent: 2005/0077181 (2005-04-01), Zierath et al.
patent: 2005/0209117 (2005-09-01), Friedrich et al.
patent: WO-02/058135 (2002-07-01), None

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