Electroplating cell

Details Electroplating cell Electroplating cell

1986-02-28

1987-09-29

Valentine, Donald R.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204237, 204273, 204275, 204297R, C25D 1706, C25D 1716

Patent

active

046967290

ABSTRACT:
An electroplating cell having a cathode assembly which is vertically mounted and which holds a plurality of wafers to be plated, and an anode which is vertically mounted adjacent to the cathode assembly. The anode and cathode are spaced apart and form opposite walls of a channel through which the plating bath flows. The plating bath is introduced through an isostatic chamber which produces, at its output, a substantially equal flow across the width of the channel so that a substantially vertical laminar flow is produced through the channel and the plated deposits are of uniform thickness within a wafer, from wafer to wafer and from batch to batch.

REFERENCES:
patent: 3458421 (1969-07-01), Dahms
patent: 3652442 (1972-03-01), Powers et al.
patent: 3933615 (1976-01-01), Levenson
patent: 4053377 (1977-10-01), Schlain et al.
patent: 4085010 (1978-04-01), Ishimori et al.
patent: 4102756 (1978-07-01), Castellani et al.
patent: 4376031 (1983-03-01), Andrus et al.
patent: 4560460 (1985-12-01), Blasing et al.

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