Electroplating bath composition and method of using

Details Electroplating bath composition and method of using Electroplating bath composition and method of using

2005-05-17

2005-05-17

King, Roy (Department: 1742)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal or alloy coating on...

C205S102000, C205S123000, C205S137000, C205S186000, C205S210000, C205S296000

Reexamination Certificate

active

06893550

ABSTRACT:
The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper electroplating in the fabrication of interconnect structures in semiconductor devices. By use of the inventive copper electroplating bath composition, the incidence of voids in the interconnect structures is reduced.

REFERENCES:
patent: 3859337 (1975-01-01), Herz et al.
patent: 4058439 (1977-11-01), Tamura et al.
patent: 4272335 (1981-06-01), Combs
patent: 4555315 (1985-11-01), Barbieri et al.
patent: 4563399 (1986-01-01), Wright, Jr.
patent: 4975159 (1990-12-01), Dahms
patent: 4990224 (1991-02-01), Mahmoud
patent: 5151167 (1992-09-01), Truong et al.
patent: 5151170 (1992-09-01), Montgomery et al.
patent: 5232575 (1993-08-01), Dodd
patent: 5433840 (1995-07-01), Dahms et al.
patent: 5514261 (1996-05-01), Herklotz et al.
patent: 5849171 (1998-12-01), Dahms et al.
patent: 5958207 (1999-09-01), Müll
patent: 5972192 (1999-10-01), Dubin et al.
patent: 6001234 (1999-12-01), Batz, Jr. et al.
patent: 6129830 (2000-10-01), Senge et al.
patent: 6210555 (2001-04-01), Taylor et al.
patent: 6224737 (2001-05-01), Tsai et al.
patent: 6261433 (2001-07-01), Landau
patent: 6440289 (2002-08-01), Woo et al.
patent: 20010015321 (2001-08-01), Reid et al.
patent: 2025538 (1971-10-01), None
patent: 199 52 273 (2000-05-01), None
patent: 0862665 (1998-09-01), None
patent: 1069210 (2000-01-01), None
patent: 0 982 771 (2000-03-01), None
patent: 1026286 (2000-08-01), None
patent: 1054080 (2000-11-01), None
patent: 1069212 (2001-01-01), None
patent: 1111096 (2001-06-01), None
patent: 1118696 (2001-07-01), None
patent: 1122989 (2001-08-01), None
patent: 1132500 (2001-09-01), None
patent: WO 0041518 (1998-12-01), None
patent: WO 9940615 (1999-08-01), None
patent: WO 0014306 (2000-03-01), None
Frederick A. Lowenheim, Electroplating, McGraw-Hill Book Co. New York, 1978, pp. 139-140, 202.*
Lowenheim, Frederick A., Electroplating, McGraw-Hill Book Company, ©1978 by McGraw-Hill, Inc. pp. 67-71.
Written Opinion for PCT/US01/12348, mailed Dec. 26, 2002, 1 page.
International Search Report PCT/US 01/12348.
Patent Abstracts of Japan, vol. 2000, No. 12, Jan. 3, 2001, and JP 2000 248397 A Electroplating Eng. of Japan Co., Sep. 12, 2000.
Kelly, J.J, et al., Leveling and Microstructural Effects of Additives for Copper Electrodeposition, Journal Of The Electrochemical Society, vol. 146, No. 7, 1999, pp. 2540-2545.

Affiliated with

Also associated with

Rating

Electroplating bath composition and method of using does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroplating bath composition and method of using, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating bath composition and method of using will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3442508