Electroplating bath and method

Chemistry: electrical and wave energy – Processes and products

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204 43G, 204 46G, C25D 362, C25D 510

Patent

active

044365950

ABSTRACT:
There is provided an improved gold alloy electroplating bath comprising glycolic acid, an alkali metal salt of glycolic acid, gold and an alloying metal plus a chelating agent capable of forming a stable complex with metal impurities, particularly nickel. The chelating agent, the complexes formed and the decomposition products of the chelating agent are substantially innocuous to the functioning of the bath and to the quality of a deposit from the bath. Nitrilotriacetic acid is the preferred chelating agent.

REFERENCES:
patent: 2724687 (1955-11-01), Spreter et al.
patent: 3149058 (1964-09-01), Parker et al.
patent: 3530049 (1970-09-01), Scherzer et al.
patent: 3666640 (1972-05-01), Smith
patent: 3708405 (1973-01-01), Kamata
patent: 3783111 (1974-01-01), Bick et al.
patent: 3902977 (1975-09-01), Greenspan
patent: 4075065 (1978-02-01), Korbelak et al.
patent: 4076598 (1978-02-01), Lerner et al.

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