Electroplating arrangements

Details Electroplating arrangements Electroplating arrangements

1982-09-30

1984-03-06

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C25D 2112

Patent

active

044352662

ABSTRACT:
An electroplating arrangement having particular use in the manufacture of stamper plates for disc record production comprises a rectangular plating bath, one side being non-vertical with respect to the bath base. A filter screen divides the bath into an anode region and a cathode region, the region including anode and cathode electrode arrangements respectively.
A stamper plate to be plated is mounted on the cathode electrode arrangement which is connected to a motor capable of rotating the arrangement about an axis perpendicular to the plate. The anode arrangement comprises an elongate porous bag containing anode material and is disposed parallel to the cathode arrangement and non-vertical wall. An electrolyte input pipe extends through the bag and screen to lie opposite the mounted stamper plate directing inflowing electrolyte thereat. An output exit is disposed within the anode region on the bath base such that the anode arrangement lies within the flowpath from said entrance to said exit.

REFERENCES:
patent: 3186932 (1965-06-01), Gelfand
patent: 4269669 (1981-05-01), Soby
patent: 4341613 (1982-07-01), Prusak
patent: 4359375 (1982-11-01), Smith

Affiliated with

Also associated with

Rating

Electroplating arrangements does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroplating arrangements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating arrangements will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-740334