Electroplating apparatus including a real-time feedback system

Details Electroplating apparatus including a real-time feedback system Electroplating apparatus including a real-time feedback system

2008-05-06

2008-05-06

Nguyen, Nam (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S228700, C204S229500

Reexamination Certificate

active

07368042

ABSTRACT:
An electro-chemical plating system includes an upper rotor assembly for receiving and holding a wafer; an electroplating reactor vessel for containing plating solution in which the wafer is immersed; an anode array including a plurality of concentric anode segments provided inside the electroplating reactor vessel; a power supply system including power supply subunits for controlling electrical potentials of the anode segments, respectively; and a plurality of sensor devices mounted inside the upper rotor assembly, wherein the sensor devices are substantially arranged in corresponding to the anode segments, and during operation, the plurality of sensor devices are utilized for in-situ feeding back a deposition profile to a control unit in real time.

REFERENCES:
patent: 6391166 (2002-05-01), Wang
patent: 6761812 (2004-07-01), Preusse et al.
patent: 7153400 (2006-12-01), Ravkin et al.
patent: 2007/0068819 (2007-03-01), Singh
patent: 592858 (2004-06-01), None

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