Electroplating apparatus for producing humps on chip components

Details Electroplating apparatus for producing humps on chip components Electroplating apparatus for producing humps on chip components

1988-02-08

1990-03-06

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204297W, C25D 1700, C25D 1706

Patent

active

049063464

ABSTRACT:
The present invention provides an improved electroplating apparatus having an electroplating cell equipped with an anode, cathode and diaphragm ring. The electroplating cell is suspended in an electrolytic bath. The cell is composed of a plastic tube whose lower opening is covered by an anode surface and whose upper opening is covered by a wafer holder for holding the semiconductor wafer. The electroplating apparatus further includes an activated carbon filtering aimed at the levelling effect.

REFERENCES:
patent: 4137867 (1979-02-01), Aigo
patent: 4170959 (1979-10-01), Aigo
patent: 4339319 (1982-07-01), Aigo
patent: 4466864 (1984-08-01), Bacon et al.
Electroplating Engineering Handbook, Edited by A. Kenneth Graham, 1962, p. 724.

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