Electroplating apparatus and four mask TFT array process...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area

Reexamination Certificate

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C205S117000, C205S118000, C205S122000, C205S123000

Reexamination Certificate

active

07001498

ABSTRACT:
An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be electroplated. The surface to be electroplated is preferably a cathode. A second chamber is formed adjacent to the first chamber and has a second opening in proximity of the first opening for removing electrolytic solution containing metal ions from the surface to be electroplated. The plurality of chambers are adapted for movement in a first direction along the surface to be electroplated.

REFERENCES:
patent: 3468785 (1969-09-01), Polichette
patent: 4376683 (1983-03-01), Hellwig et al.
patent: 5270229 (1993-12-01), Ishihara
patent: 6143155 (2000-11-01), Adams et al.
patent: 6547937 (2003-04-01), Oberlitner et al.
patent: 6586766 (2003-07-01), Yamazaki et al.

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