Electroplating apparatus

Details Electroplating apparatus Electroplating apparatus

1998-07-31

2000-07-25

Valentine, Donald R.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204275, 204284, C25D 1700, C25B 900, C25B 1100

Patent

active

060932910

ABSTRACT:
An electroplating apparatus is made up of a cup having a plating solution therein, a plating solution controlling unit which overflows the plating solution from the cup, a holding unit which holds an object to be plated so as to contact to the overflowed plating solution, and a mesh shaped anode electrode provided in an internal portion of the cup, the mesh shaped anode electrode having a surface comprising a metal which are plated by the plating solution. Accordingly, the electroplating apparatus can get the plated film having a smooth surface.

REFERENCES:
patent: 5228966 (1993-07-01), Murata
patent: 5391285 (1995-02-01), Lytle
patent: 5443707 (1995-08-01), Mori
patent: 5514258 (1996-05-01), Brinket et al.

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