Electroplating apparatus

Details Electroplating apparatus Electroplating apparatus

1988-10-14

1989-10-03

Valentine, Donald R.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204228, 204237, 204238, 204275, 204276, 204286, 204231, C25D 1702, C25D 1706, C25D 2106

Patent

active

048714356

ABSTRACT:
A process and an apparatus for coating a printed circuit board in a horizontal position in a coating chamber by flooding the chamber while the printed circuit board is suspended horizontally in a coating chamber between at least two anodes with adjustable power applied to the anodes provides for a uniform coating of the board and the aperture therein.

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patent: 4033832 (1977-07-01), Sterling et al.
patent: 4222834 (1980-09-01), Bacon et al.
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patent: 4323441 (1982-04-01), Schaer et al.
patent: 4466864 (1984-08-01), Bacon et al.
patent: 4514266 (1985-04-01), Cole et al.
patent: 4560460 (1985-12-01), Blasing et al.
patent: 4634503 (1987-01-01), Nogavich
patent: 4655881 (1987-04-01), Tezuka et al.
patent: 4696729 (1987-09-01), Santini
patent: 4755271 (1988-07-01), Hosten

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