Electroplating apparatus

Details Electroplating apparatus Electroplating apparatus

2007-07-18

2010-11-09

Van, Luan V (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S198000, C204S297010

Reexamination Certificate

active

07828944

ABSTRACT:
An electroplating apparatus includes: a wafer holder that is detachable from an engaging hole of a cathode holder and capable of moving in a up and down direction; a spring contact type cathode electrode that is fixed to an electrode housing recess on a top surface of the wafer holder and presses against a backside of a wafer placed on the wafer holder; and a suction pad that is fixed to a pad housing recess on a top surface of the wafer holder and suctions the backside of the wafer placed on the wafer holder.

REFERENCES:
patent: 4428815 (1984-01-01), Powell et al.
patent: 6416647 (2002-07-01), Dordi et al.
patent: 2006328470 (2006-12-01), None

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