Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent
1996-02-16
1997-08-26
Niebling, John
Chemistry: electrical and wave energy
Apparatus
Electrolytic
269 21, 204297R, C25D 1706
Patent
active
056606990
ABSTRACT:
An electroplating apparatus has a cathode base for supporting a substrate, and a clamper for clamping a peripheral edge portion of the substrate against the cathode base. A plating solution is supplied onto the substrate so that the surface of the substrate is plated. A negative pressure source clamps the substrate by drawing the clamper under a negative pressure through a suction conduit.
REFERENCES:
patent: 3536594 (1970-10-01), Pritchard
patent: 4381964 (1983-05-01), Lock
patent: 4856766 (1989-08-01), Huberts
patent: 5167792 (1992-12-01), Kamitakahara
Misumi Hisashi
Saito Tadashi
Sato Atsushi
Kao Corporation
Mee Brendan
Niebling John
LandOfFree
Electroplating apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electroplating apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1985478