Electroplating apparatus

Details Electroplating apparatus Electroplating apparatus

1997-06-19

1998-11-10

Valentine, Donald R.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204224R, 204277, 118 501, 118416, 118504, C25D 1700, C23C 1400, B05C 300

Patent

active

058338209

ABSTRACT:
Gas shielding is employed to prevent metal plating on contacts during electroplating to reduce particulate contamination and increase thickness uniformity. In another embodiment, gas shielding is employed to prevent deposition on the backside and edges of a semiconductor wafer during plating.

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