Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent
1986-10-31
1988-01-26
Niebling, John F.
Chemistry: electrical and wave energy
Apparatus
Electrolytic
204224R, C25D 706, C25D 1710
Patent
active
047215542
ABSTRACT:
In a method for high-speed electrolytic-deposition of metallic layers on ribbon or cord-like strips, the strips which are electrically connected to the negative side of an electric DC power source are moved through a hollow guide rail containing an electrolyte solution and past an anode structure arranged within the hollow guide rail and connected to the positive side of the DC power source. An electrolyte solution circulating conduit structure including a circulating pump is connected to opposite ends of the guide rail and, while the metal is deposited on the strip which is moved through the guide rail in one direction, the electrolyte solution is circulated through the guide rail in the opposite direction at a speed which provides for a Reynolds No. of over 80,000 with regard to the relative strip speed in the electrolyte solution so as to provide turbulent flow conditions adjacent the strip surface which greatly increase the electrolyte deposition rates.
The hollow guide rail is preferably arranged vertically with the strip moving upwardly and the electrolyte solution flowing downwardly through the guide rail.
REFERENCES:
patent: 2370973 (1945-03-01), Tang
patent: 3522166 (1970-07-01), Jones
patent: 3644181 (1972-02-01), Donaldson
patent: 3650935 (1972-03-01), Andersson
patent: 3865701 (1975-02-01), Borgmann
patent: 4014773 (1977-03-01), Furuya
patent: 4304653 (1981-12-01), Winand
patent: 4347115 (1982-08-01), Espenhahn et al.
patent: 4378284 (1983-03-01), Iwasaki et al.
patent: 4434040 (1984-02-01), Brendlinger
patent: 4505785 (1985-03-01), Miwa et al.
Inovan-Stroebe GmbH & Co. KG.
Leader William T.
Niebling John F.
LandOfFree
Electroplating apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electroplating apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1467066