Electroplating anode plenum

Details Electroplating anode plenum Electroplating anode plenum

1976-05-03

1977-12-13

Prescott, Arthur C.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204 49, 204225, 204284, C25C 108, C25C 702

Patent

active

040627551

ABSTRACT:
The anode of an electroplating apparatus is incorporated in a sparging plenum. The plenum has an insulating partition separating the anodically biased electrode from the workpieces being plated. The partition has a regular array of orifices. Electrolyte is pumped into the plenum and flows out of the partition, providing a spacially uniform supply of fresh solution to the workpieces. In a soluble anode process, the solution is replenished in the plenum. In an exemplary apparatus, one major surface of the plenum is a titanium tray, which holds pieces of nickel, which dissolve during the nickel plating process.

REFERENCES:
patent: 669439 (1901-03-01), Frasch
patent: 1765706 (1930-06-01), Stewart et al.
patent: 3450625 (1969-06-01), Ramsey et al.
patent: 3617449 (1971-11-01), Giles
patent: 3875041 (1975-04-01), Harvey et al.
patent: 3894924 (1975-07-01), Toledo

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