Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent
1997-11-13
2000-10-03
Bell, Bruce F.
Chemistry: electrical and wave energy
Apparatus
Electrolytic
204283, 204297R, 204297W, C25B 1300
Patent
active
061267988
ABSTRACT:
An anode includes an anode cup, a membrane and ion source material, the anode cup and membrane forming an enclosure in which the ion source material is located. The anode cup includes a base section having a central aperture and the membrane also has a central aperture. A jet is passed through the central apertures of the base section of the anode cup and through the membrane allowing plating solution to be directed at the center of a wafer being electroplated.
REFERENCES:
patent: 3962047 (1976-06-01), Wagner
patent: 4137867 (1979-02-01), Aigo
patent: 4170959 (1979-10-01), Aigo
patent: 4246088 (1981-01-01), Murphy et al.
patent: 4259166 (1981-03-01), Whitehurst
patent: 4280882 (1981-07-01), Hovey
patent: 4304641 (1981-12-01), Grandia et al.
patent: 4339297 (1982-07-01), Aigo
patent: 4341613 (1982-07-01), Aigo
patent: 4466864 (1984-08-01), Bacon et al.
patent: 4469566 (1984-09-01), Wray
patent: 4534832 (1985-08-01), Doiron
patent: 4565607 (1986-01-01), Hanak et al.
patent: 4597836 (1986-07-01), Schaer et al.
patent: 4696729 (1987-09-01), Santini
patent: 4828654 (1989-05-01), Reed
patent: 4861452 (1989-08-01), Stierman et al.
patent: 4879007 (1989-11-01), Wong
patent: 4906346 (1990-03-01), Hadersbeck et al.
patent: 4931149 (1990-06-01), Stierman et al.
patent: 5000827 (1991-03-01), Schuster et al.
patent: 5024746 (1991-06-01), Stierman et al.
patent: 5078852 (1992-01-01), Yee et al.
patent: 5096550 (1992-03-01), Mayer et al.
patent: 5135636 (1992-08-01), Yee et al.
patent: 5222310 (1993-06-01), Thompson et al.
patent: 5227041 (1993-07-01), Brogden et al.
patent: 5332487 (1994-07-01), Young et al.
patent: 5372699 (1994-12-01), Rischke et al.
patent: 5377708 (1995-01-01), Bergman et al.
patent: 5391285 (1995-02-01), Lytle et al.
patent: 5405518 (1995-04-01), Hsich et al.
patent: 5421987 (1995-06-01), Tzanavaras et al.
patent: 5429733 (1995-07-01), Ishida
patent: 5437777 (1995-08-01), Kishi
patent: 5441629 (1995-08-01), Kosaki
patent: 5443707 (1995-08-01), Mori
patent: 5447615 (1995-09-01), Ishida
patent: 5462649 (1995-10-01), Keeney et al.
patent: 5472592 (1995-12-01), Lowery
patent: 5498325 (1996-03-01), Nishimura et al.
patent: 5522975 (1996-06-01), Andricacos et al.
patent: 5597460 (1997-01-01), Reynolds
patent: 5670034 (1997-09-01), Lowery
patent: 5725745 (1998-03-01), Ikegaya
patent: 5750014 (1998-05-01), Stadler et al.
patent: 5776327 (1998-07-01), Botts et al.
patent: 5788829 (1998-08-01), Joshi et al.
patent: 5804052 (1998-09-01), Schneider
patent: 5843296 (1998-12-01), Greenspan
patent: 5855850 (1999-01-01), Sittler
"Upside-Down Resist Coating of Seminconductor Wafers", IBM Technical Disclosure Bulletin, vol. 32, No. 1, Jun. 1989, pp. 311-313.
Evan E. Patton, et al. "Automated Gold Plate-Up Bath Scope Document and Machine Specifications", Tektronix Confidential, dated Aug. 4, 1989, pp. 1-13.
Tektronix Invention Disclosure Form (Company Confidential), not dated, 4 pages
Contolini Robert J.
Dukovic John Owen
Reid Jonathan David
Bell Bruce F.
International Business Machines Corp.
Novellus Systems Inc.
Steuber David E.
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