Dynamic magnetic information storage or retrieval – Head – Coil
Patent
1995-02-17
1997-04-15
Wolff, John H.
Dynamic magnetic information storage or retrieval
Head
Coil
360126, G11B 517
Patent
active
056215940
ABSTRACT:
A thin film helical conductor coil assembly includes an electrically-nonconducting ceramic substrate having a substantially planar surface and separated first and second magnetic elements which mutually bound a volume of the ceramic substrate. The thin film conductor coil assembly also includes a thin film magnetic core, which magnetically connects the first magnetic element to the second magnetic element. The thin film magnetic core, which overlies the substantially planar surface of the ceramic substrate, is constructed from a compliant electroplated magnetic material. The thin film conductor coil assembly further includes an electroplated thin film helical coil which traverses about the thin film magnetic core and forms a conductive path from a first terminal to a second terminal.
REFERENCES:
patent: 3662119 (1972-05-01), Romankiw et al.
patent: 3723665 (1973-03-01), Lazzari et al.
patent: 4251910 (1981-02-01), Griffith
patent: 4639289 (1987-01-01), Lazzari
patent: 4829659 (1989-05-01), Deroux-Dauphin
patent: 4933209 (1990-06-01), Anthony et al.
patent: 4949207 (1990-08-01), Lazzari
patent: 4992897 (1991-02-01), Deroux-Dauphin
patent: 5022141 (1991-06-01), Nagata et al.
patent: 5059278 (1991-10-01), Cohen et al.
patent: 5065271 (1991-11-01), Matsuura et al.
patent: 5090111 (1992-02-01), Lazzari
patent: 5163218 (1992-11-01), Hamilton
patent: 5166845 (1992-11-01), Thompson et al.
patent: 5260845 (1993-11-01), Takayama et al.
patent: 5274521 (1993-12-01), Miyauchi et al.
patent: 5408373 (1995-04-01), Bajorek et al.
patent: 5465475 (1995-11-01), Kinoshita et al.
A. Sano, M. Egawa, M. Nitta, K. Takayanagi, T. Matsushita, and T. Fujita, A Low Inductance Metal-In-Gap Head Using a Side-Core Concept, IEEE Transactions on Magnetics, vol. 29, No. 6, Nov. 1993, pp. 3888-3890.
IBM Technical Disclosure Bulletin, vol. 37, No. 12, Dec. 1994, Armonk, N.Y., US, pp. 77-79, "Thin Film Type Laminated Head".
Patent Abstracts of Japan, vol. 170 (P-373), 16 Jul. 1985 & JP-A-60-045931 (Hitachi Seisakusho KK), 12 Mar. 1985.
Patent Abstracts of Japan, vol. 9, No. 314 (P-412), 10 Dec. 1985 & JP-A-60-145512 (Suwa Sekosha KK), 1 Aug. 1985.
Patent Abstracts of Japan, vol. 13, No. 322 (P-902), 20 Jul. 1989 & JP-A-01-088911 (Hitachi Ltd.) 3 Apr. 1989.
Patent Abstracts of Japan, vol. 5, No. 150 (P-081), 22 Sep. 1981 & JP-A-56-083689 (Fujitsu Ltd), 8 Jul. 1981.
Gray G. Robert
Malhotra Arun
AIWA Research and Development Inc.
Wolff John H.
LandOfFree
Electroplated thin film conductor coil assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electroplated thin film conductor coil assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplated thin film conductor coil assembly will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-365663