Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Agitating or moving electrolyte during coating
Patent
1990-11-06
1992-02-04
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Agitating or moving electrolyte during coating
205266, 205268, C25D 356, C25D 362, C25D 358
Patent
active
050857444
ABSTRACT:
A solution for electroplating gold-copper-zinc alloys. A solution containing excess cyanide and hydroxide ions, gold and copper each in the form of a cyanide complex, and zinc at least partially in the form of a zincate complex. Additives such as conductivity salts, chelating agents, surfactants or wetting agents, brightening agents, and reducing agents may also be present to impart a particular feature or characteristic to the solution. Also, a process for electroplating up to about 20 microns of a gold-copper-zinc alloy upon a substrate using these novel solutions. The alloy is deposited upon a substrate which is immersed in the solution by electroplating at a current density of between about 1 and 15 ASF (0.1 to 1.5 ASDM) at a temperature of about 60.degree. and 120.degree. F. for a sufficient time to obtain the desired thickness. Generally, thicknesses of 5 to 10 microns or more can be obtained without microcracking. Finally, method for increasing the ductility and corrosion resistance of the deposit by simply heating the deposit to about 50.degree. to 200.degree. C. in air for a time of about 2 to 24 hours.
REFERENCES:
patent: 3672969 (1972-06-01), Nobel et al.
patent: 3915814 (1975-10-01), Greenspan
patent: 4358351 (1982-11-01), Simon et al.
patent: 4366035 (1982-12-01), Wilkinson
patent: 4980035 (1990-12-01), Emmenegger
Japanese Abstract 57-5886, "Gold Alloy Plating Bath", Togawa (1/82).
Lea-Ronal, Inc.
Marquis Steven P.
Niebling John
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