Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly alloy coating
Patent
1992-04-15
1993-10-26
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly alloy coating
205248, C25D 362
Patent
active
052562751
ABSTRACT:
A solution for electroplating gold-copper-silver alloys. The solution comprises gold, copper and silver, each in the form of a cyanide complex. The solution further comprises a divalent sulfur compound capable of brightening and leveling the electroplated deposit of the gold-copper-silver alloy. Optionally, a source of cyanide ions such as a free alkali cyanide, is included in the solution. In addition, additives such as surface active agents, buffers and/or conductivity salts may also be included to impart a particular feature or characteristic to the solution. The invention additionally comprises a process for electroplating up to about 20 microns of a gold-copper-silver alloy upon a substrate utilizing these novel solutions. The alloy is deposited upon a substrate which is immersed in the solution, by electroplating at a current density of between about 1 and 15 ASF, a pH of between about 8-11 at a temperature of between about 100.degree.-170.degree. F. for a time sufficient to obtain the desired thickness. Improved brightness results are obtained with the process of the invention by manipulating the electroplating current.
REFERENCES:
patent: 4465564 (1984-08-01), Fletcher et al.
patent: 4869971 (1989-09-01), Nee et al.
patent: 5006208 (1991-04-01), Kuhn et al.
Chemical Abstract 78: 66285p Mar. 12, 1973.
Bolam Brian M.
Lea-Ronal, Inc.
Niebling John
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