Electroplaner

Details Electroplaner Electroplaner

1998-12-07

2000-08-22

Valentine, Donald R.

Electrolysis: processes, compositions used therein, and methods

Electrolytic erosion of a workpiece for shape or surface...

Local application of electrolyte

205670, 205672, 205686, 204224M, 204225, B23H 300, B23H 726, B23H 1100

Patent

active

061066907

ABSTRACT:
An electroplaning technique achieves superior flatness of the face of a wafer. A chuck holds the wafer so the face of the wafer is oriented downwards and lowers it to an electroplaner stage. The electroplaner includes an elongated, horizontally extending cup, an elongated horizontally extending nozzle within it. Electrolyte flows non-turbulently from an upper side of the nozzle to create a meniscus of electrolyte that contacts the wafer. The electroplaner moves transversely while the chuck is held steady so that said meniscus sweeps across the face of said wafer. A rinser of similar construction likewise has a meniscus or rinse that sweeps across the wafer. The nozzle can have a row of openings along its upper side, or may be formed at least in part of a microporous material. The wafer is electrically configured as cathode.

REFERENCES:
patent: 2763608 (1956-09-01), Pool
patent: 4222834 (1980-09-01), Bacon et al.
patent: 5865984 (1999-02-01), Corbin, Jr. et al.

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