Radiation imagery chemistry: process – composition – or product th – Electric or magnetic imagery – e.g. – xerography,... – Radiation-sensitive composition or product
Patent
1998-12-14
2000-01-18
Martin, Roland
Radiation imagery chemistry: process, composition, or product th
Electric or magnetic imagery, e.g., xerography,...
Radiation-sensitive composition or product
430 73, G03G 509
Patent
active
060156465
ABSTRACT:
The present invention provides an electrophotosensitive material comprising a photosensitive layer containing a m-phenylenediamine compound represented by the general formula (1): ##STR1## wherein R.sup.1A and R.sup.1B are the same or different and indicate an alkyl group; and R.sup.1C, R.sup.1D, R.sup.1E and R.sup.1F are the same or different and indicate a hydrogen atom or an alkyl group, which has high sensitivity and issuperior in stability to strong light, durability and heat resistance, and an image forming method capable of realizing more higher speed and more larger energy saving than the prior art.
REFERENCES:
patent: 5213926 (1993-05-01), Hanatani et al.
patent: 5334470 (1994-08-01), Shimada et al.
patent: 5494765 (1996-02-01), Fukami et al.
Database WPI, Section ch. Week 9012, Class E14, An 90-085939, Derwent Publications Ltd., London, GB.
Database WPI, Section ch. Week 9321, Class E14, An 93-172642, Derwent Publications ltd., London, GB.
Chemical Abstracts, vol. 123, No. 2, p. 949, Jul. 10, 1995, Columbus, Ohio, U.S.A.
Iwasaki Hiroaki
Matsumoto Shyunichi
Saitoh Sakae
Uchida Maki
Watanabe Yukimasa
Martin Roland
Mita Industrial Co. Ltd.
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