Radiation imagery chemistry: process – composition – or product th – Electric or magnetic imagery – e.g. – xerography,... – Radiation-sensitive composition or product
Reexamination Certificate
2006-08-15
2006-08-15
Chapman, Mark A. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Electric or magnetic imagery, e.g., xerography,...
Radiation-sensitive composition or product
C430S059600, C430S096000
Reexamination Certificate
active
07090952
ABSTRACT:
The present invention provides an electrophotosensitive material comprising a conductive substrate and a photosensitive layer provided on the conductive substrate, wherein the photosensitive layer contains a polyarylate having a repeating unit represented by the general formula (1):wherein X represents a phenylene group, a naphthylene group, or a biphenylene group, as a binder resin. The polyarylate is contained in the amount of 30% by weight or more based on the entire binder resin. The electrophotosensitive material of the present invention have improved wear resistance and gas resistance while reconciling both characteristics, and thus longer life has been achieved.
REFERENCES:
patent: 4933245 (1990-06-01), Akasaki et al.
patent: 6090514 (2000-07-01), Kakui et al.
patent: 6573017 (2003-06-01), Azuma et al.
patent: 59-071057 (1984-04-01), None
patent: 61-55672 (1986-11-01), None
patent: 63-261267 (1988-10-01), None
patent: 5-297601 (1993-11-01), None
patent: 5-341539 (1993-12-01), None
patent: 8-110646 (1996-04-01), None
patent: 9-22126 (1997-01-01), None
Azuma Jun
Watanabe Yukimasa
Yashima Ayako
Chapman Mark A.
Kyocera Mita Corporation
Smith , Gambrell & Russell, LLP
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