Radiation imagery chemistry: process – composition – or product th – Electric or magnetic imagery – e.g. – xerography,... – Radiation-sensitive composition or product
Patent
1992-11-20
1994-12-06
Rodee, Christopher D.
Radiation imagery chemistry: process, composition, or product th
Electric or magnetic imagery, e.g., xerography,...
Radiation-sensitive composition or product
430 66, 430 77, 430 83, J03H 509, J03H 5147
Patent
active
053709535
ABSTRACT:
The invention presents an electrophotosensitive material comprising a conductive substrate, a photosensitive layer formed on the conductive substrate, and, if necessary, a surface protective layer formed on the photosensitive layer, wherein an oxadiazole derivative expressed in a general formula (I): ##STR1## where R.sup.1 denotes an alkyl group, is contained as an electron transfer substance on the photosensitive layer and/or surface protective layer. This photosensitive material enhances the electron transfer capability, and hence the sensitivity is improved. At the same time, the residual potential of the photosensitive material is lowered, and the stability and durability against repeated exposures are enhanced.
REFERENCES:
patent: 3189447 (1965-06-01), Neugebauer et al.
patent: 3666683 (1972-05-01), Maeder et al.
patent: 4758488 (1988-07-01), Johnson et al.
patent: 5294510 (1994-03-01), Ueda et al.
Patent Abstracts of Japan, vol. 12, No. 427 (P-784)(3274), Nov. 11, 1988, to Tamaki.
Database WPIL Derwent, AN 83-60461K, relating to Japanese Patent Publication No. 58-082252, May 17, 1983.
Database WPIL Derwent, AN 85-180853, relating to Japanese Patent Publication No. 60108860, Jun. 14, 1985.
Mita Industrial Co. Ltd.
Rodee Christopher D.
LandOfFree
Electrophotosensitive material does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrophotosensitive material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrophotosensitive material will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-213393