Electrophoretic insulation of metal circuit board core

Details Electrophoretic insulation of metal circuit board core Electrophoretic insulation of metal circuit board core

1987-06-17

1987-12-22

Kittle, John E.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428209, 427 96, B32B 300, B05D 512

Patent

active

047146460

ABSTRACT:
A printed circuit with an internal metal sheet for heat dissipation has a roughened aluminum sheet with via holes coated with acrylic or epoxy resin containing thixotropic fumed silicon dioxide or silicate clay. The resin and thixotropic agent are electrophoretically coated. The thixotropic agent may act both to even the coating around edges and as a material upon which metal plating of the printed circuit is bonded.

REFERENCES:
patent: 3441489 (1969-04-01), Gacesa
patent: 3483109 (1969-12-01), Brane et al.
patent: 3892646 (1975-07-01), Lazzarini et al.
patent: 4145460 (1979-03-01), Finley et al.
patent: 4321290 (1982-03-01), Thams
patent: 4562119 (1985-12-01), Darms et al.
patent: 4601916 (1986-07-01), Arachtingi
"Metal Core Boards--An Alternative for Cooling Critical Components", Sep. 1980 Circuits Manufacturing, pp. 74-80.
Keith F. Blurton et al, "Insulated Holes in Metal Core Substrate", PCK Technology Division, Kollomorgen Corporation.

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