Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-08-01
2006-08-01
Soward, Ida M. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S467000, C257S468000, C257S625000, C257S675000, C257S706000, C257S707000, C257S712000, C257S714000, C257S715000, C257S716000
Reexamination Certificate
active
07084495
ABSTRACT:
A stack of heat generating integrated circuit chips may be provided with intervening cooling integrated circuit chips. The cooling integrated circuit chips may include microchannels for the flow of the cooling fluid. The cooling fluid may be pumped using the integrated electroosmotic pumps. Removal of cooling fluid gases may be accomplished using integrated re-combiners in some embodiments.
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List et al., U.S. Appl. No. 10/402,435, filed Mar. 28, 2003, entitled “Electroosmotic Pump Using Nanoporous Dielectric Frit”.
Kim et al., U.S. Appl. No. 10/669,205, filed Sep. 24, 2003, entitled “Integrated Re-Combiner for Electroosmotic Pumps Using Porous Frits”.
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Kim Sarah E.
List R. Scott
Maveety James G.
Myers Alan M.
Vu Quat T.
Soward Ida M.
Trop Pruner & Hu P.C.
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