Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Reexamination Certificate
1999-03-01
2001-07-03
Bovernick, Rodney (Department: 2874)
Optical waveguides
With disengagable mechanical connector
Optical fiber to a nonfiber optical device connector
C385S092000
Reexamination Certificate
active
06254285
ABSTRACT:
BACKGROUND OF THE INVENTION
Field of the Invention
The invention is in the field of optically coupling an electrooptical transmitter or an optoelectronic receiver, also denoted below as an electrooptical transducer or an electrooptical component, to a coupling partner (e.g. an optical fiber end). The invention further relates to an electrooptical module that has on a front side a coupling socket for holding an optical fiber end, and at a rear side a holding region for an electrical component. The component is fixed by an adhesive that is introduced into a joint gap, extending perpendicular to the longditudinal axis of the coupling socket, between the holding region and the electrooptical component and/or a component carrier.
Such a module is disclosed in Published, Non-Prosecuted German Patent Application DE 31 38 197 A1 and includes a coupling part having a coupling socket into which a capillary with an optical fiber end running centrally in the direction of the capillary longitudinal axis can be inserted for the purpose of optical coupling to an electrooptical component. Provided on the side opposite the socket is a holding region for an electrooptical component whose housing is fixed on the side by an adhesive. The adhesive is located in this configuration in a joint gap that extends perpendicular to the longitudinal axis of the coupling socket. The stability of the adhesive connection is comparatively low against mechanical and thermal tensile or shear loads, and this can disadvantageously affect the coupling efficiency.
SUMMARY OF THE INVENTION
It is accordingly an object of the invention to provide an electrooptical module that overcomes the above-mentioned disadvantages of the prior art devices of this general type, in which a high coupling efficiency is ensured which is stable in the long term and as far as possible independent of changes in external conditions.
With the foregoing and other objects in view there is provided, in accordance with the invention, an electrooptical module, including: a front side; a coupling socket disposed on the front side for holding an optical fiber end and having a longitudinal axis; a rear side; a holding region disposed at the rear side and connected to the coupling socket; an electrooptical component disposed in the holding region; a component carrier connected to the electrooptical component, the holding region and at least one of the component carrier and the electrooptical component having a joint gap formed therebetween, the joint gap between the holding region and at least one of the component carrier and the electrooptical component extending perpendicular to the longitudinal axis of the coupling socket; an adhesive disposed in the joint gap for fixing in place the electrooptical component; and at least one of the electrooptical component, the component carrier and the holding region having openings formed therein, the openings leading to the joint gap, tapering toward the joint gap, and receiving the adhesive disposed in the joint gap.
The object is achieved according to the invention in the case of a module of the type mentioned at the beginning by virtue of the fact that the electrooptical component and/or the component carrier and/or the holding region is provided with openings which lead to the joint gap and taper toward the joint gap, and are introduced into the adhesive.
A substantial advantage of the module according to the invention consists in its increased stability, in particular against thermal cycling, because the connection between the component or the component carrier and the holding region is strengthened by the adhesive self-closure in the openings. Mechanical or thermal loads therefore cannot so easily lead to a deviation from the original optimum component position. A further advantage of the module according to the invention consists in the comparatively simple application and the accessibility, which promotes the adhesive curing, of the adhesive in the openings. To be precise, the adhesive can advantageously be spread in a single work operation over the surface of the holding region that is perpendicular to the longitudinal axis of the coupling socket or to the optimum axis, and subsequently enters the openings.
In order to permit an eccentric offset, possibly produced during the adjustment, between the electrooptical component or its component carrier and the holding region to be compensated and, furthermore, to permit communication of the openings, according to an advantageous development of the invention the openings of the electrooptical component and/or of the component carrier, on the one hand, and the openings of the holding region, on the other hand, have different widths on the joint gap side.
A development of the invention which is preferred in terms of production engineering and in mechanical terms consists in that the component is held by an annular component carrier which is disposed opposite a flange of the holding region with the formation of the joint gap.
It is preferred in terms of production engineering to use an adhesive that can be cured both by light and by heat. The compositions disclosed in Published, Non-Prosecuted German Patent Application 195 45 552 A dated Jun. 12, 1995 and those in Published European Application EP 0 504 569 A2 as well as the two-component adhesive marketed under the trade name of DELO-DUOKATÒ VE 293 by DELO Industrieklebstoffe GmbH & Co. KG, Ohmstr. 3, 86899 Landsberg, Germany, have proved to be particularly suitable for this purpose. The openings can advantageously permit additional access of light for the purpose of optical curing of the adhesive.
In order to provide the electrooptical module with a mechanically particularly firm connection of the electrooptical component to the coupling socket and/or the holding region thereof, according to a preferred embodiment of the invention, it is provided that, between at least one tongue and at least one cutout of the holding region of the coupling socket and electrooptical component, at least one adhesive gap aligned parallel to the longitudinal axis of the coupling socket borders on the joint gap with a gap width which permits the electrooptical component to be aligned into a position of maximum optical coupling.
In the case of the module according to the invention, the at least one tongue on the holding region of the coupling socket or on the electrooptical component, and the at least one cutout can correspondingly be provided on the electrooptical component or on the holding region. However, it is also possible to provide in each case more than one tongue and more than one cutout if this is permitted by the structural and optical requirements placed on the electrooptical module.
It is regarded as particularly advantageous when the holding region of the coupling socket is provided on its outer edge with a plurality of tongues in the form of pins, and the electrooptical component is provided on its outer edge with cutouts which are flush with the pins in the mounted state.
To be specific, the result of this is that relatively large regions of the adhesive gaps can be exposed to the light, and this is necessary for prefixing the adhesive used by means of optical curing.
Other features which are considered as characteristic for the invention are set forth in the appended claims.
Although the invention is illustrated and described herein as embodied in an electrooptical module, it is nevertheless not intended to be limited to the details shown, since various modifications and structural changes may be made therein without departing from the spirit of the invention and within the scope and range of equivalents of the claims.
The construction and method of operation of the invention, however, together with additional objects and advantages thereof will be best understood from the following description of specific embodiments when read in connection with the accompanying drawings.
REFERENCES:
patent: 5715099 (1998-02-01), Takemoto
patent: 27 47 773 A1 (1978-06-01), None
patent: 31 38 197 A1 (1983-06-01), None
patent
Grumm Mathias
Hanke Bernd
Meyer-Guldner Frank
Olze Oliver
Steffensen Andreas
Bovernick Rodney
Greenberg Laurence A.
Infineon - Technologies AG
Lerner Herbert L.
Stahl Michael
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