Electronics package with integrated lugs for cooling attachment

Details Electronics package with integrated lugs for cooling attachment Electronics package with integrated lugs for cooling attachment

2008-06-27

2011-11-22

Sandvik, Benjamin (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Device held in place by clamping

C257S706000, C257SE23026

Reexamination Certificate

active

08063485

ABSTRACT:
A board mounted integrated electronics package assembly is provided with one or more securing elements to attach a heat dissipating device directly to the package. The securing element(s) is located along a periphery of the package and anchors a base of the heat dissipating device to the package, thereby eliminating employment of a secondary heat dissipating material between the package and the heat dissipating device.

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