Electronics package including heat sink in the housing and...

Details Electronics package including heat sink in the housing and... Electronics package including heat sink in the housing and...

2008-08-20

2011-12-20

Smith, Courtney (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S707000, C257S706000, C257S720000, C428S614000

Reexamination Certificate

active

08081467

ABSTRACT:
An electronics package may include a housing and electronic circuitry carried thereby. The housing may include a first metallic material having a first coefficient of thermal expansion (CTE) and having an array of openings therein. The electronics package may also include a thermally conductive body within each of the openings in the array thereof to thereby define a heat sink for the electronic circuitry. Each of the thermally conductive bodies may include a second metallic material having a second CTE substantially different from the first CTE.

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