Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-09-03
2000-07-04
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361687, 361700, 361717, 257707, 257713, 174 152, 174 163, 16510421, 16510433, H05K 720
Patent
active
060847727
ABSTRACT:
An electronics enclosure is provided with passive thermal management for a high power electronic units, for example a power amplifier for wireless telecommunications, the enclosure being suitable for mast head mounted units, or remotely located units exposed to a wide range of weather conditions. The use of heat pipes in place of a conventional heat sink provides for natural convection cooling and eliminates the need for fans. Appropriate selection of materials, using copper and aluminum respectively, for the construction of heat pipe and cooling fin assemblies provides a significant reduction in weight and volume is achieved relative to know units having conventional heatsinks and forced air convection cooling. Since the heat pipe efficiency decreases at low temperature, the power amplifier self heats the unit in cold weather and eliminates the need for heaters. This further reduces the power consumption and the size of the unit.
REFERENCES:
patent: 4673030 (1987-06-01), Basiulis
patent: 4675783 (1987-06-01), Murase et al.
patent: 4873127 (1989-10-01), Onodera et al.
patent: 4963833 (1990-10-01), Mountz
patent: 5285347 (1994-02-01), Fox et al.
patent: 5332979 (1994-07-01), Roskewitsch et al.
patent: 5352991 (1994-10-01), Lipschultz et al.
patent: 5367434 (1994-11-01), Griffin et al.
patent: 5440453 (1995-08-01), Cooke et al.
patent: 5651414 (1997-07-01), Suzuki et al.
Pell David J.
Sahraoui Melik
Zapach Trevor G.
Datskovsky Michael
de Wilton Angela C.
Nortel Networks Corporation
Picard Leo P.
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