Electronics enclosure and method of fabricating an...

Details Electronics enclosure and method of fabricating an... Electronics enclosure and method of fabricating an...

2007-11-13

2007-11-13

Harvey, James R. (Department: 2833)

Electrical connectors

With sealing element or material for cooperation with...

Including chamber for contact potting

C439S936000

Reexamination Certificate

active

11533494

ABSTRACT:
A device for enclosing electronics and providing an electrical connection to the enclosed electronics is provided. The device includes a housing having alignment and barrier features, and a circuit board having alignment features and plated through-holes. The circuit board is coupled to the housing such that the alignment features of the circuit board and housing are aligned, and such that the barrier features of the housing are located adjacent the plated through-holes. The device further includes an epoxy material that at least partially coats the surfaces of the housing and circuit board. The barrier features separate the plated through-holes from the epoxy material, such that the epoxy material is not in contact with the interior surface of the plated through-holes. A method for enclosing electronics and providing an electrical connection to the enclosed electronics is also provided.

REFERENCES:
patent: 5703754 (1997-12-01), Hinze
patent: 5895883 (1999-04-01), Bhatti et al.
patent: 6729889 (2004-05-01), Bauer
patent: 6900383 (2005-05-01), Babb et al.
patent: 6964575 (2005-11-01), Sailor
patent: 7048564 (2006-05-01), Hinze

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