Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-12-20
1999-12-21
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361689, 361704, 361709, 361710, 165 803, 165185, 257714, H05K 720
Patent
active
060057718
ABSTRACT:
A spacecraft avionics module in which integrated circuit chip packages or chips are mounted in direct contact with the surface of a radiator panel, to enhance dissipation of heat from the integrated circuit and to allow electronics to be packed more densely while still dissipating sufficient heat to allow the electronics to operate at a desirable temperature. Conduction of heat from the electronics to the radiator panel is further enhanced by the use of a thermally conductive adhesive disposed between the integrated circuit chip packages or chips and the radiator panel, which may include heatpipes for more uniform heat distribution across the panel.
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patent: 5661902 (1997-09-01), Katchmar
Bjorndahl William D.
Coronel Ramon
Espinosa Janice W.
Tsutsumi Paul T.
Chervinsky Boris L.
Picard Leo P.
TRW Inc.
Yatsko Michael S.
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