Electronics cooling subassembly

Details Electronics cooling subassembly Electronics cooling subassembly

2005-06-28

2005-06-28

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S121000, C165S122000, C257S722000, C361S697000, C361S703000

Reexamination Certificate

active

06912128

ABSTRACT:
A thermo-electro sub-assembly comprises a gas supply, a first duct, a first heatsink adjacent a first device, a second duct, and a second heat sink adjacent a second device. The gas supply may be realized as a fan, a blower, or a compressed gas source. The first duct provides a passageway for delivering pressurized gas from the gas supply to the first heat sink. The duct may include a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The first heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises an axial shaped folded fin heatsink. The second duct is used to provide a pathway for the air leaving the first heatsink and delivers the air to the second heatsink. The second duct may also include a plurality of vanes for reducing turbulence and boundary flow separation within the second duct.

REFERENCES:
patent: 1288330 (1918-12-01), White
patent: 1348328 (1920-08-01), Sonnenbor
patent: 1429927 (1922-09-01), Carter
patent: 1444480 (1923-02-01), Patch
patent: 1475595 (1923-11-01), Bingay
patent: 1571300 (1926-02-01), Reed
patent: 1631711 (1927-06-01), Treanor
patent: 3305704 (1967-02-01), Battista
patent: 4449164 (1984-05-01), Carlson et al.
patent: 4469269 (1984-09-01), Ito et al.
patent: 4520425 (1985-05-01), Ito
patent: 4601331 (1986-07-01), Kessler, Jr. et al.
patent: 4745960 (1988-05-01), Karp
patent: 5077601 (1991-12-01), Hatada et al.
patent: 5107398 (1992-04-01), Bailey
patent: 5132780 (1992-07-01), Higgins, III
patent: 5218514 (1993-06-01), Huynh et al.
patent: 5309318 (1994-05-01), Beilstein, Jr. et al.
patent: 5570740 (1996-11-01), Flores et al.
patent: 5597035 (1997-01-01), Smith et al.
patent: 5640046 (1997-06-01), Suzuki et al.
patent: 5706169 (1998-01-01), Yeh
patent: 5912802 (1999-06-01), Nelson
patent: 5946188 (1999-08-01), Rochel et al.
patent: 6021042 (2000-02-01), Anderson et al.
patent: 6021844 (2000-02-01), Butchelder
patent: 6031720 (2000-02-01), Crane, Jr. et al.
patent: 6034871 (2000-03-01), Cheng
patent: 6034873 (2000-03-01), Stahl et al.
patent: 6104607 (2000-08-01), Behl
patent: 6113485 (2000-09-01), Marquis et al.
patent: 6130820 (2000-10-01), Konstad et al.
patent: 6145586 (2000-11-01), Lo
patent: 6179046 (2001-01-01), Hwang et al.
patent: 6199624 (2001-03-01), Wotring
patent: 6230789 (2001-05-01), Pei et al.
patent: 6330154 (2001-12-01), Fryers et al.
patent: 6401807 (2002-06-01), Wyler et al.
patent: 6442024 (2002-08-01), Shih
patent: 199 08 160.3 (1999-02-01), None
patent: 200 15 931.3 (2001-01-01), None
patent: 0 702 405 (1996-03-01), None
patent: 0 817 555 (1998-01-01), None
patent: 0998180 (2000-05-01), None
patent: 1117284 (2001-07-01), None
patent: 2 339 897 (2000-02-01), None
patent: 2 354 316 (2001-03-01), None
EG & G Wakefield Engineering catalog of Series 200 heatsinks (Jun. 1985).
Drawing of Svetlana SK-2A Socket for use with Svetlana 3CX300A1 and forced air cooling (Jun. 2001).

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